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Toshiba пуска CMOS сензор със задна подсветка
Публикувано във неделя, 01 ноември 2009 в 23:00 часа от BgFotoNET
Фото технологии

Toshiba Back-Illuminated CMOS SensorКомпанията Toshiba анонсира нов 14.6 Мрх CMOS сензор със задна подсветка, който предлага подобрена светлочувствителност. Производството на новият сензор ще започне през декември 2009 год., като масовата продукция ще се появи на пазара през третата четвърт на 2010 година. Сензорът е с форм-фактор 1/2.3”, а стъпката между пикселите му е само 1.4 микрона, като Toshiba обещава, че ще “донесе качеството на снимките с мобилни телефони на ново ниво”...

Toshiba Launches Back-Illuminated CMOS Sensor

Източник: Прессъобщение на Toshiba

Toshiba Press Release

Toshiba Corporation launches highly sensitive CMOS image sensor with BSI

Applies world’s first 300mm wafer lines for BSI technology

27 Oct, 2009

TOKYO— Toshiba Corporation (TOKYO: 6502) today announced the launch of a new CMOS image sensor that will bring 14.6 million pixels to digital still cameras and to mobile phones supporting video imaging. The sensor, the latest addition to Toshiba’s “Dynastron™” line-up, is also the company’s first to integrate the enhanced sensitivity offered by back-side illumination technology (BSI). Sampling of the new sensor will begin in December and mass production will follow from the third quarter of 2010 (July—September).

BSI brings new levels of responsiveness to CMOS imaging. Lenses are deployed on the rear of the sensor on the silicon substrate, not on the front, where wiring limits light absorption. This positioning boosts light sensitivity and absorption by 40% compared to existing Toshiba products, and allows formation of finer image pixels.

Toshiba has made full use of the advantages of BSI to realize image pixels with a pitch of 1.4 microns, and to pack 14.6 million of them into a 1/2.3-inch sensor that meets the high level imaging and processing requirement, and that will also bring a new level of image quality to mobile phones. Toshiba will use the new sensor to promote its full-scale entry to digital camera market, and will continue to develop BSI products as a mainstream technology.

The new sensor will be mass produced at Toshiba’s Oita Operations, on industry leading 300mm wafer lines deploying 65nm process technology. Initial production will be at a volume of 500,000 sensors a month.

CMOS image sensors are a focus product of Toshiba’s System LSI business. Until now, their main application has been in mobile phones, where Toshiba could leverage its high density integration and low power consumption technologies. With the introduction of BSI CMOS sensors, Toshiba will reinforce the sensor business by expanding application to include digital cameras.
Key features

Optical format: 1/ 2.3 inch
Number of pixels: 14.6 mega pixels
Size of pixels: 1.4 micro meter
Frame rate: 60 frame per sec. (Supports 1080p, 720p)

Note: Dynastron is a trademark of Toshiba Corporation

 
 

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